Laser Via Drilling

Via Drilling with a Laser

In the electronics industry, a "via" is a hole through a material that, when filled with a conductive material such as copper or silver-conductive ink, creates an electrical connection between at least two conductive layers. The simplest form involves two conductive layers separated by an insulating substrate, commonly either polyamide (PI), polyester (PET), or epoxy resin. Vias can be "through" or "blind" type:

Through vias are drilled through all layers of the laminate structure.
Blind vias are initiated at one surface and stop at a layer interface within the laminate.

Applications

Flexible Printed Circuits (FPC)
Medical Devices / Sensors

Radio-Frequency Identification (RFID)
Photovoltaics (Solar Cells)

Small Diameter Drilling

Vias are routinely drilled by mechanical methods with diameters 0.020" (0.50mm) down to 0.004" (0.10mm). However, as the diameter decreases, the vias become more difficult and costly to produce using mechanical methods. An advantage that laser via drilling (or microvia drilling) offers is that lasers can readily drill small diameter vias from 0.008" (0.20mm) down to 0.001" (0.025mm).

MATERIALS

Polyester (PET)
Polyimide (PI)
Epoxy Resins
FPC or PCB Laminats
Copper (Cu)
Gold (Au)
Silver (Ag)

INDUSTRIES

Medical
Electronics
Energy

Advantages

Preco's applications engineering team has extensive knowledge in laser drilling of flexible sheets and roll-to-roll materials and can assist you in developing an appropriate laser system for your application.